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Intel INTC Assembly and Test — Net revenue
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Where this comes from
Reported directly by Intel in its filing.
Tagged under the XBRL concept us-gaap:RevenueFromContractWithCustomerExcludingAssessedTax.
The source filing: Intel’s 10-Q, filed July 24, 2026.
- Filed
- Jul 23, 2026, 8:00 PM EDT
- Fiscal quarter
- Q2 FY2026
- Calendar quarter
- Q2 2026
- Accession
- 0000050863-26-000157
- Segment revenue: consists substantially of intersegment product and services revenue for wafer fabrication, substrates and other related products and services sold to Intel Products and certain other Intel internal businesses. We recognize intersegment revenue based on the completion of performance obligations. Product revenue is recognized upon transfer of ownership, which is generally at the completion of wafer sorting. Backend service revenue is recognized upon the completion of assembly and test milestones, which approximates the recognition of revenue over the service period. Intersegment sales are recorded at prices that are intended to approximate market pricing. Intel Foundry also includes certain third-party foundry and assembly and test revenues from external customers that totaled $293 million in the three months ended June 27, 2026 and $467 million in the first six months of 2026 ($22 million in the three months ended June 28, 2025 and $53 million in the first six months of 2025).
- Segment expenses: consists of direct expenses for technology development, product manufacturing and services provided by Intel Foundry to internal and external customers, allocated expenses as described below and direct operating expenses. Direct expenses for product manufacturing include excess capacity charges, if any.
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FAQ
- What is Intel's assembly and test — net revenue?
- Intel (INTC) reported assembly and test — net revenue of $293M in Q2 2026.
- What does assembly and test — net revenue mean?
- This metric represents the total net revenue generated from semiconductor assembly and testing services provided to internal or external customers. It reflects the financial performance of the back-end manufacturing stage where processed wafers are diced, packaged, and verified for quality. Monitoring this revenue stream provides insight into the company's operational capacity and the demand for its specialized post-fabrication processing capabilities.
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